In this paper, we present a novel design methodology to combat the ever-aggravating high frequency power supply noise (di/dt) in modern microprocessors. Our methodology integrates ...
Michael B. Healy, Fayez Mohamood, Hsien-Hsin S. Le...
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
Abstract— Since carrier frequency offset destroys user’s signal orthogonality in Orthogonal Frequency-Division Multiplexing Access (OFDMA) uplink transmission, resulting in an ...