As Field-Programmable Gate Array (FPGA) power consumption continues to increase, lower power FPGA circuitry, architectures, and Computer-Aided Design (CAD) tools need to be develo...
A novel high-level approach for estimating power consumption of global interconnects in data-path oriented designs implemented in FPGAs is presented. The methodology is applied to...
Mobile networks are becoming increasingly popular as a means for distributing information to a large number of users. In comparison to wired networks, mobile networks are distingu...
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...