19 search results - page 4 / 4 » Voltage island-driven floorplanning |
TPDS
2010
13 years 3 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
MJ
2011
13 years 8 days ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Computational complexity has been the primary challenge of many VLSI CAD applications. The emerging multicore and manycore microprocessors have the potential to offer scalable perf...
MICRO
2006
IEEE
13 years 11 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...