In view of a booming market for microelectronic implants, our ongoing research work is focusing on the specification and design of a novel biomedical microprocessor core targeting...
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
Emerging memory technologies such as STT-RAM, PCRAM, and resistive RAM are being explored as potential replacements to existing on-chip caches or main memories for future multi-co...
Asit K. Mishra, Xiangyu Dong, Guangyu Sun, Yuan Xi...