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ISVLSI
2003
IEEE
91views VLSI» more  ISVLSI 2003»
9 years 6 months ago
Three-Dimensional Integrated Circuits: Performance, Design Methodology, and CAD Tools
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
Shamik Das, Anantha Chandrakasan, Rafael Reif
DATE
2008
IEEE
129views Hardware» more  DATE 2008»
9 years 7 months ago
Memory Technology for Extended Large-Scale Integration in Future Electronics Applications
Extending 2-D planar topologies in integrated circuits (ICs) to a 3-D implementation has the obvious benefits of reducing the overall footprint and average interconnection length,...
Dinesh Pamunuwa
DATE
2009
IEEE
150views Hardware» more  DATE 2009»
9 years 8 months ago
A software-supported methodology for exploring interconnection architectures targeting 3-D FPGAs
—Interconnect structures significantly contribute to the delay, power consumption, and silicon area of modern reconfigurable architectures. The demand for higher clock frequencie...
Kostas Siozios, Vasilis F. Pavlidis, Dimitrios Sou...
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