ISVLSI
2003
IEEE
13 years 10 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
DATE
2008
IEEE
13 years 11 months ago
2008
IEEE
Extending 2-D planar topologies in integrated circuits (ICs) to a 3-D implementation has the obvious benefits of reducing the overall footprint and average interconnection length,...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
—Interconnect structures significantly contribute to the delay, power consumption, and silicon area of modern reconfigurable architectures. The demand for higher clock frequencie...