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GLVLSI
2006
IEEE
101views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Measurement and characterization of pattern dependent process variations of interconnect resistance, capacitance and inductance
Process variations have become a serious concern for nanometer technologies. The interconnect and device variations include interand intra-die variations of geometries, as well as...
Xiaoning Qi, Alex Gyure, Yansheng Luo, Sam C. Lo, ...
GLVLSI
2006
IEEE
142views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Dynamic instruction schedulers in a 3-dimensional integration technology
We present the design of high-performance and energy-efficient dynamic instruction schedulers in a 3-Dimensional integration technology. Based on a previous observation that the c...
Kiran Puttaswamy, Gabriel H. Loh
GLVLSI
2006
IEEE
119views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Thermal analysis of a 3D die-stacked high-performance microprocessor
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
Kiran Puttaswamy, Gabriel H. Loh
GLVLSI
2006
IEEE
87views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Maximum effective distance of on-chip decoupling capacitors in power distribution grids
Mikhail Popovich, Eby G. Friedman, Michael Sotman,...
GLVLSI
2006
IEEE
115views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Yield enhancement of asynchronous logic circuits through 3-dimensional integration technology
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...
Song Peng, Rajit Manohar
GLVLSI
2006
IEEE
193views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Optimizing noise-immune nanoscale circuits using principles of Markov random fields
As CMOS devices and operating voltages are scaled down, noise and defective devices will impact the reliability of digital circuits. Probabilistic computing compatible with CMOS o...
Kundan Nepal, R. Iris Bahar, Joseph L. Mundy, Will...
GLVLSI
2006
IEEE
144views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Crosstalk analysis in nanometer technologies
Process variations have become a key concern of circuit designers because of their significant, yet hard to predict impact on performance and signal integrity of VLSI circuits. St...
Shahin Nazarian, Ali Iranli, Massoud Pedram
GLVLSI
2006
IEEE
129views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Delay and peak power minimization for on-chip buses using temporal redundancy
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K. Najeeb, Vishal Gupta, V. Kamakoti, Madhu Mutyam
GLVLSI
2006
IEEE
185views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Application of fast SOCP based statistical sizing in the microprocessor design flow
In this paper we have applied statistical sizing in an industrial setting. Efficient implementation of the statistical sizing algorithm is achieved by utilizing a dedicated interi...
Murari Mani, Mahesh Sharma, Michael Orshansky
GLVLSI
2006
IEEE
95views VLSI» more  GLVLSI 2006»
13 years 10 months ago
Test generation using SAT-based bounded model checking for validation of pipelined processors
Functional verification is one of the major bottlenecks in microprocessor design. Simulation-based techniques are the most widely used form of processor verification. Efficient ...
Heon-Mo Koo, Prabhat Mishra