DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
Abstract— We present an SoC testing approach that integrates test data compression, TAM/test wrapper design, and test scheduling. An improved LFSR reseeding technique is used as ...
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
Modern systems-on-a-chip platforms support multiple clock domains, in which different sub-circuits are driven by different clock signals. Although the frequency of each domain can...
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
Double-via placement is important for increasing chip manufacturing yield. Commercial tools and recent work have done a great job for it. However, they are found with a limited ca...
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
Partial reconfiguration allows parts of the reconfigurable chip area to be configured without affecting the rest of the chip. This allows placement of tasks at run time on the rec...
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
This paper discusses several forms of heterogeneity in systems on chip and systems in package. A means to distinguish the various forms of heterogeneity is given, with an estimati...
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...