DFT
2004
IEEE
13 years 8 months ago
2004
IEEE
We present a model for computing the probability of a parametric failure due to a spot defect. The analysis is based on electromigration in conductors under unidirectional current...
DFT
2004
IEEE
13 years 8 months ago
2004
IEEE
A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned col...