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    ISQED
    2006
    IEEE
    75views Hardware» more  ISQED 2006»
    Interconnect and Thermal-aware Floorplanning for 3D Microprocessors
    13 years 11 months ago
    Interconnect and Thermal-aware Floorplanning for 3D Microprocessors
    Download  www.cse.psu.edu
    Interconnects are becoming an increasing problem from both performance and power consumption perspective in fu
    Wei-Lun Hung, Greg M. Link, Yuan Xie, Narayanan Vi...
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