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9

ISQED
2006
IEEE

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Interconnect and Thermal-aware Floorplanning for 3D Microprocessors

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Interconnect and Thermal-aware Floorplanning for 3D Microprocessors

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Interconnects are becoming an increasing problem from both performance and power consumption perspective in fu

Wei-Lun Hung, Greg M. Link, Yuan Xie, Narayanan Vi

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Hardware | Interconnects | ISQED 2006 | Power Consumption Perspective |

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Added	12 Jun 2010
Updated	12 Jun 2010
Type	Conference
Year	2006
Where	ISQED
Authors	Wei-Lun Hung, Greg M. Link, Yuan Xie, Narayanan Vijaykrishnan, Mary Jane Irwin

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