Sciweavers

Share
ISQED
2006
IEEE

Interconnect and Thermal-aware Floorplanning for 3D Microprocessors

9 years 9 months ago
Interconnect and Thermal-aware Floorplanning for 3D Microprocessors
Interconnects are becoming an increasing problem from both performance and power consumption perspective in fu
Wei-Lun Hung, Greg M. Link, Yuan Xie, Narayanan Vi
Added 12 Jun 2010
Updated 12 Jun 2010
Type Conference
Year 2006
Where ISQED
Authors Wei-Lun Hung, Greg M. Link, Yuan Xie, Narayanan Vijaykrishnan, Mary Jane Irwin
Comments (0)
books