ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
DAC
2010
ACM
13 years 2 months ago
2010
ACM
Integrating a large number of on-chip voltage regulators holds the promise of solving many power delivery challenges through strong local load regulation and facilitates systemlev...
ISPD
2004
ACM
13 years 10 months ago
2004
ACM
High performance integrated circuits are now reaching the 100-plus watt regime, and power delivery and power grid signal integrity have become critical. Analyzing the performance ...
MICRO
2006
IEEE
13 years 11 months ago
2006
IEEE
Power delivery is a growing reliability concern in microprocessors as the industry moves toward feature-rich, powerhungrier designs. To battle the ever-aggravating power consumpti...
MICRO
2009
IEEE
13 years 11 months ago
2009
IEEE
The increasing power dissipation of current processors and processor cores constrains design options, increases packaging and cooling costs, increases power delivery costs, and de...
ASPLOS
2010
ACM
13 years 11 months ago
2010
ACM
Data center power infrastructure incurs massive capital costs, which typically exceed energy costs over the life of the facility. To squeeze maximum value from the infrastructure,...