GLVLSI
2010
IEEE
13 years 10 months ago
2010
IEEE
The development of compiler-based mechanisms to reduce the percentage of hotspots and optimize the thermal profile of large register files has become an important issue. Thermal...
ISQED
2006
IEEE
13 years 11 months ago
2006
IEEE
The increase in packing density has led to a higher power density in the chip which in turn has led to an increase in temperature on the chip. Temperature affects reliability, per...
ASPDAC
2009
ACM
13 years 11 months ago
2009
ACM
— Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC designers. In this work, we model the thermal behavior of a MPSoC as a control theory pro...