ISQED
2002
IEEE
13 years 10 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
DAC
2007
ACM
14 years 6 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...