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ISCAS
2003
IEEE

Micromachined piezoresistive tactile sensor array fabricated by bulk-etched MUMPs process

14 years 20 days ago
Micromachined piezoresistive tactile sensor array fabricated by bulk-etched MUMPs process
The design, fabrication and testing of a 5 5 micromachined tactile sensor array for the detection of an extremely small force (micrometer-Newton range) has been discussed. An anisotropic etching of silicon substrate of a MUMPs process chip forms a central contacting pads that are trampoline-shape suspended structures and sensor beams. A piezoresistive layer of polysilicon embedded in sensor beams is used to detect the displacement of the suspended contacting pad. Each square tactile has dimension of 200 m 200 m with 250 m center-to-center spacing. The entire sensor area
Tanom Lomas, A. Tuantranont, F. Cheevasuvit
Added 04 Jul 2010
Updated 04 Jul 2010
Type Conference
Year 2003
Where ISCAS
Authors Tanom Lomas, A. Tuantranont, F. Cheevasuvit
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