34 search results - page 4 / 7 » 3D floorplanning with thermal vias |
124
Voted
TPDS
2010
15 years 6 days ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
129
Voted
DAC
2007
ACM
16 years 2 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
140
click to vote
NANONET
2009
Springer
15 years 6 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
113
click to vote
ASPDAC
2007
ACM
15 years 5 months ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
126
Voted
ICPP
2008
IEEE
15 years 8 months ago
2008
IEEE
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...