3 search results - page 1 / 1 » A Comprehensive Layout Methodology and Layout-Specific Circu... |
ISQED
2002
IEEE
14 years 2 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
CHES
2005
Springer
14 years 2 months ago
2005
Springer
Electromagnetic analysis (EMA) can be used to compromise secret information by analysing the electric and/or magnetic fields emanating from a device. It follows differential power...
ASPDAC
2008
ACM
13 years 11 months ago
2008
ACM
Accurate modeling of delay, power, and area of interconnections early in the design phase is crucial for effective system-level optimization. Models presently used in system-level...