In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
Hua Lu 0003, K. C. Hung, Stoyan Stoyanov, Chris Ba...
: Software qualities are in many cases tacit and hard to measure. Thus, there is a potential risk that they get lower priority than deadlines, cost and functionality. This paper pr...
: Automated test case and test driver generation from a precise behaviour UML model is an emerging approach for software functional validation. This innovative approach for validat...
A central issue in knowledge management and software process improvement is to learn from experience. In software engineering, most experience is gathered in projects, which makes ...
Abstract Nowadays, process oriented software systems, like many business information systems, don't exist only in one single version, but in many variants for better coverage ...