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MR
2002
100views Robotics» more  MR 2002»
14 years 9 months ago
No-flow underfill flip chip assembly--an experimental and modeling analysis
In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
Hua Lu 0003, K. C. Hung, Stoyan Stoyanov, Chris Ba...
ISPW
2009
IEEE
15 years 4 months ago
Software Product Quality: Ensuring a Common Goal
: Software qualities are in many cases tacit and hard to measure. Thus, there is a potential risk that they get lower priority than deadlines, cost and functionality. This paper pr...
Sebastian Barney, Claes Wohlin
SE
2007
14 years 11 months ago
Requirements traceability in the model-based testing process
: Automated test case and test driver generation from a precise behaviour UML model is an emerging approach for software functional validation. This innovative approach for validat...
Eddy Bernard, Bruno Legeard
EUROSPI
2007
Springer
15 years 4 months ago
Organizational Learning Through Project Postmortem Reviews - An Explorative Case Study
A central issue in knowledge management and software process improvement is to learn from experience. In software engineering, most experience is gathered in projects, which makes ...
Torgeir Dingsøyr, Nils Brede Moe, Joost J. ...
BIS
2006
122views Business» more  BIS 2006»
14 years 11 months ago
Variability Mechanisms in E-Business Process Families
Abstract Nowadays, process oriented software systems, like many business information systems, don't exist only in one single version, but in many variants for better coverage ...
Arnd Schnieders, Frank Puhlmann