Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
In this paper we propose a RObust Analog Design tool (ROAD) for post-tuning analog/RF circuits. Starting from an initial design derived from hand analysis or analog circuit synthe...
Xin Li, Padmini Gopalakrishnan, Yang Xu, Lawrence ...
This paper presents the modeling paradigm for Integrated Modular Avionics Design MIMAD V0, which is an extensible component-oriented framework that enables high level models of sy...
Improvements in semiconductor integration density and the resulting problem of having to manage designs of increasing complexity is an old one, but still current. The new challeng...
Using FPGAs to accelerate High Performance Computing (HPC) applications is attractive, but has a huge associated cost: the time spent, not for developing efficient FPGA code but fo...