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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
15 years 26 days ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
ICCAD
2004
IEEE
155views Hardware» more  ICCAD 2004»
16 years 12 hour ago
Robust analog/RF circuit design with projection-based posynomial modeling
In this paper we propose a RObust Analog Design tool (ROAD) for post-tuning analog/RF circuits. Starting from an initial design derived from hand analysis or analog circuit synthe...
Xin Li, Padmini Gopalakrishnan, Yang Xu, Lawrence ...
EUROMICRO
2006
IEEE
15 years 9 months ago
A Modeling Paradigm for Integrated Modular Avionics Design
This paper presents the modeling paradigm for Integrated Modular Avionics Design MIMAD V0, which is an extensible component-oriented framework that enables high level models of sy...
Abdoulaye Gamatié, Christian Brunette, Roma...
ASAP
1997
IEEE
156views Hardware» more  ASAP 1997»
15 years 7 months ago
Design methodology for digital signal processing
Improvements in semiconductor integration density and the resulting problem of having to manage designs of increasing complexity is an old one, but still current. The new challeng...
Gerhard Fettweis
ARC
2010
Springer
183views Hardware» more  ARC 2010»
15 years 3 months ago
Integrated Design Environment for Reconfigurable HPC
Using FPGAs to accelerate High Performance Computing (HPC) applications is attractive, but has a huge associated cost: the time spent, not for developing efficient FPGA code but fo...
Lilian Janin, Shoujie Li, Doug Edwards