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DAC
2011
ACM
13 years 9 months ago
DRAIN: distributed recovery architecture for inaccessible nodes in multi-core chips
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
Andrew DeOrio, Konstantinos Aisopos, Valeria Berta...
DAC
2011
ACM
13 years 9 months ago
Understanding the impact of power loss on flash memory
Flash memory is quickly becoming a common component in computer systems ranging from music players to mission-critical server systems. As flash plays a more important role, data ...
Hung-Wei Tseng, Laura M. Grupp, Steven Swanson
DAC
2011
ACM
13 years 9 months ago
Supervised design space exploration by compositional approximation of Pareto sets
Technology scaling allows the integration of billions of transistors on the same die but CAD tools struggle in keeping up with the increasing design complexity. Design productivit...
Hung-Yi Liu, Ilias Diakonikolas, Michele Petracca,...
DAC
2011
ACM
13 years 9 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
DAC
2011
ACM
13 years 9 months ago
Fault-tolerant 3D clock network
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
Chiao-Ling Lung, Yu-Shih Su, Shih-Hsiu Huang, Yiyu...
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