Abstract--In double patterning lithography (DPL) layout decomposition for 45nm and below process nodes, two features must be assigned opposite colors (corresponding to different ex...
Andrew B. Kahng, Chul-Hong Park, Xu Xu, Hailong Ya...
We present a novel approach to relation extraction that integrates information across documents, performs global inference and requires no labelled text. In particular, we tackle ...
—Aggregate scheduling is one of the most promising solutions to the issue of scalability in networks, like DiffServ networks and high speed switches, where hard QoS guarantees ar...
We present a new approach to 3D scene modeling based on geometric constraints. Contrary to the existing methods, we can quickly obtain 3D scene models that respect the given const...
Marta Wilczkowiak, Gilles Trombettoni, Christophe ...
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
Yu Chen, Andrew B. Kahng, Gabriel Robins, Alexande...