The performance of Kriging interpolation for enhancement, smoothing, reconstruction and optimization of a test data set is investigated. Specifically, the ordinary twodimensional ...
We present a method for image interpolation which is able to create high-quality, perceptually convincing transitions between recorded images. By implementing concepts derived fro...
Timo Stich, Christian Linz, Christian Wallraven, D...
At system level, the on-chip temperature depends both on power density and the thermal coupling with the neighboring regions. The problem of finding the right set of input power pr...
Nowadays a placement problem often involves multi-million objects and excessive fixed blockages. We present a new global placement algorithm that scales well to the modern large-s...
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...