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134
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ICCAD
2007
IEEE
16 years 1 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
150
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ICCAD
2005
IEEE
16 years 1 months ago
2005
IEEE
We present a new hardware synthesis methodology for guarded atomic actions (or rules), which satisfies performance-related scheduling specifications provided by the designer. The ...
135
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ICCAD
2001
IEEE
16 years 1 months ago
2001
IEEE
In high-speed digital VLSI design, bounding the load capacitance at gate outputs is a well-known methodology to improve coupling noise immunity, reduce degradation of signal trans...
133
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SOSP
2003
ACM
16 years 1 months ago
2003
ACM
Peer-to-peer storage systems assume that their users consume resources in proportion to their contribution. Unfortunately, users are unlikely to do this without some enforcement m...
154
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CVPR
2009
IEEE
15 years 11 months ago
2009
IEEE
Most research on image decomposition, e.g. image segmentation and image parsing, has predominantly focused on the low-level visual clues within single image and neglected the cont...