- This paper presents a new aged timing simulation methodology that can be used for hot-carrier reliability assurance of VLSI. This methodology consists of a compact model and a un...
Interconnect with an insufficient width may be subject to electromigration and eventually cause the failure of the circuit at any time during its lifetime. This problem has gotten...
We present simulations for ultra-thin body, fully-depleted, double-gate (DG) silicon-on-insulator (SOI) devices that can be readily optimized for both static power loss and perfor...
—Time-dependent performance degradation due to transistor aging caused by mechanisms such as Negative Bias Temperature Instability (NBTI) and Hot Carrier Injection (HCI) is one o...
This paper describes a SPICE model development methodology for Quantum-Dot Cellular Automata (QCA) cells and presents a SPICE model for QCA cells. The model is validated by simula...