As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate threedimensional interconnect models. In this paper, we describe...
Nuno Alexandre Marques, Mattan Kamon, Jacob White,...
Within-die process variations arise during integrated circuit (IC) fabrication in the sub-100nm regime. These variations are of paramount concern as they deviate the performance of...
Abstract--A novel input and output biasing circuit to extend the input common mode (CM) voltage range and the output swing to rail-to-rail in a low voltage op-amp in standard CMOS ...
S. V. Gopalaiah, A. P. Shivaprasad, Sukanta K. Pan...
This paper describes a formal verification methodology of highnthesis (HLS) process. The abstraction level of the input to HLS is so high compared to that of the output that the v...
Chandan Karfa, Dipankar Sarkar, Chittaranjan A. Ma...
We propose gate level statistical simulation to bridge the gap between the most accurate Monte Carlo SPICE simulation and the most efficient circuit level statistical static timi...