As CMOS technology scales deeper into the nanometer regime, factors such as leakage power and chip temperature emerge as critically important concerns for high-performance VLSI des...
As technology advances, the metal width is decreasing with the length increasing, making the resistance along the power line increase substantially. Together with the nonlinear sc...
This paper presents an efficient statistical design methodology that allows simultaneous sizing for performance and optimization for yield and robustness of analog circuits. The s...
It has been observed that even highly optimized software programs perform "redundant" computations during their execution, due to the nature (statistics) of the values a...
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...