Abstract. An important surface modeling problem in CAD is to connect two disjoint B-spline patches with the second-order geometric continuity. In this paper we present a study to s...
The paper proposes an efficient terminal and model order reduction method for compact modeling of interconnect circuits with many terminals. The new method is inspired by the rece...
Pu Liu, Sheldon X.-D. Tan, Boyuan Yan, Bruce McGau...
Parametric representations used for symbolic simulation of circuits usually use BDDs. After a few steps of symbolic simulation, state set representation is converted from one para...
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
In this paper, we present a new multi-packing tree (MP-tree) representation for macro placement to handle mixed-size designs. Based on binary trees, the MP-tree is very efficient,...