499 search results - page 15 / 100 » A Three-Phase Algorithm for Computer Aided siRNA Design |
DAC
2012
ACM
12 years 12 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
MOBICOM
2004
ACM
15 years 2 months ago
2004
ACM
Recent years have seen the growing popularity of multi-rate wireless network devices (e.g., 802.11a cards) that can exploit variations in channel conditions and improve overall ne...
DAC
2004
ACM
15 years 2 months ago
2004
ACM
A Module-Rased design flow for digital ICs with hard and sofl modules is presented. Versions of the sofl modules are implemented with different areddelay characteristics. The vers...
71
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DAC
2009
ACM
15 years 10 months ago
2009
ACM
Computational complexity has been the primary challenge of many VLSI CAD applications. The emerging multicore and manycore microprocessors have the potential to offer scalable perf...
DAC
2002
ACM
15 years 10 months ago
2002
ACM
A central problem in functional verification is to check that a circuit block is producing correct outputs while enforcing that the environment is providing legal inputs. To attac...