499 search results - page 8 / 100 » A Three-Phase Algorithm for Computer Aided siRNA Design |
DAC
2009
ACM
15 years 10 months ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
GECCO
2009
Springer
15 years 4 months ago
2009
Springer
Multi-material 3D-printing technologies permit the freeform fabrication of complex spatial arrangements of materials in arbitrary geometries. This technology has opened the door t...
170
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DAC
2011
ACM
13 years 9 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
ISCAS
2006
IEEE
15 years 3 months ago
2006
IEEE
The efficient design of multiplierless implementa- The goal is to find the optimal sub-expressions across all N dot tions of constant matrix multipliers is challenged by the huge p...
69
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DAC
2003
ACM
15 years 10 months ago
2003
ACM
The classic algorithm for optimal buffer insertion due to van Ginneken has time and space complexity O(n2 ), where n is the number of possible buffer positions. We present a new a...