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ICCAD
2005
IEEE
15 years 8 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
SOSP
2003
ACM
15 years 8 months ago
2003
ACM
Many interesting large-scale systems are distributed systems of multiple communicating components. Such systems can be very hard to debug, especially when they exhibit poor perfor...
109
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SOSP
2005
ACM
15 years 8 months ago
2005
ACM
Disk performance is increasingly limited by its head positioning latencies, i.e., seek time and rotational delay. To reduce the head positioning latencies, we propose a novel tech...
IUI
2010
ACM
15 years 8 months ago
2010
ACM
We present two studies that evaluate the accuracy of human responses to an intelligent agent’s data classification questions. Prior work has shown that agents can elicit accurat...
135
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WWW
2010
ACM
15 years 6 months ago
2010
ACM
With the prosperity of tourism and Web 2.0 technologies, more and more people have willingness to share their travel experiences on the Web (e.g., weblogs, forums, or Web 2.0 comm...