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ISPD
2007
ACM
151views Hardware» more  ISPD 2007»
14 years 11 months ago
Pattern sensitive placement for manufacturability
When VLSI technology scales toward 45nm, the lithography wavelength stays at 193nm. This large gap results in strong refractive effects in lithography. Consequently, it is a huge...
Shiyan Hu, Jiang Hu
ICCD
2006
IEEE
77views Hardware» more  ICCD 2006»
15 years 6 months ago
Iterative-Constructive Standard Cell Placer for High Speed and Low Power
Abstract— Timing and low power emerge as the most important goals in contemporary design. Meanwhile, the majority of placement algorithms developed by industry and academia still...
Sungjae Kim, Eugene Shragowitz
ICCAD
2009
IEEE
151views Hardware» more  ICCAD 2009»
14 years 7 months ago
Timing yield-aware color reassignment and detailed placement perturbation for double patterning lithography
Double patterning lithography (DPL) is a likely resolution enhancement technique for IC production in 32nm and below technology nodes. However, DPL gives rise to two independent, ...
Mohit Gupta, Kwangok Jeong, Andrew B. Kahng
ISPD
2004
ACM
189views Hardware» more  ISPD 2004»
15 years 3 months ago
Almost optimum placement legalization by minimum cost flow and dynamic programming
VLSI placement tools usually work in two steps: First, the cells that have to be placed are roughly spread out over the chip area ignoring disjointness (global placement). Then, i...
Ulrich Brenner, Anna Pauli, Jens Vygen
ICCAD
2004
IEEE
180views Hardware» more  ICCAD 2004»
15 years 6 months ago
Physical placement driven by sequential timing analysis
Traditional timing-driven placement considers only combinational delays and does not take into account the potential of subsequent sequential optimization steps. As a result, the ...
Aaron P. Hurst, Philip Chong, Andreas Kuehlmann