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DAC
2006
ACM
15 years 10 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
ASPLOS
2009
ACM
15 years 10 months ago
Anomaly-based bug prediction, isolation, and validation: an automated approach for software debugging
Software defects, commonly known as bugs, present a serious challenge for system reliability and dependability. Once a program failure is observed, the debugging activities to loc...
Martin Dimitrov, Huiyang Zhou
MOBISYS
2006
ACM
15 years 9 months ago
Measurement driven deployment of a two-tier urban mesh access network
Multihop wireless mesh networks can provide Internet access over a wide area with minimal infrastructure expenditure. In this work, we present a measurement driven deployment stra...
Joseph Camp, Joshua Robinson, Christopher Steger, ...
DAC
2009
ACM
15 years 10 months ago
Interconnection fabric design for tracing signals in post-silicon validation
Post-silicon validation has become an essential step in the design flow of today's complex integrated circuits. One effective technique that provides real-time visibility to ...
Xiao Liu, Qiang Xu
DAC
2007
ACM
15 years 10 months ago
Optimal Selection of Voltage Regulator Modules in a Power Delivery Network
High efficiency low voltage DC-DC conversion is a key enabler to the design of power-efficient integrated circuits. Typically a star configuration of the DC-DC converters, where o...
Behnam Amelifard, Massoud Pedram