As feature sizes decrease and chip sizes increase, the area and performance of chips become dominated by the interconnect. In spite of this trend, most existing synthesis systems ...
At the present time, several shortcomings prevent the more effective use and more intense application of web information systems. Recent developments that are subsumed by the term...
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
The advent of networking technologies and high performance transport protocols facilitates the service of storage over networks. However, they pose challenges in integration and i...
Jiesheng Wu, Pete Wyckoff, Dhabaleswar K. Panda, R...
We have developed a system architecture, measuring and modeling techniques, and algorithms for on-line power and energy optimization and thermal management. The starting point for...