Modern IC design requires accurate analysis and modeling of chip-level interconnect, the substrate and package parasitics. Traditional approaches for such analyses are computation...
In this paper we propose a new design methodology targeted for core-based designs using parameterized macrocells (PMC’s). This methodology provides the flexibility for instance...
Makram M. Mansour, Mohammad M. Mansour, Amit Mehro...
— In this paper, we present a high-level power model to estimate the power consumption in semi-global and global interconnects. Such interconnects are used for communications bet...
There is an increasing need for obtaining a reasonably accurate estimate of energy dissipation in SoC designs. Array structures have a significant contribution to the total system...
Abstract-- Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; considering thermal effects early in the design c...
Wei Huang, Karthik Sankaranarayanan, Kevin Skadron...