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DATE
1999
IEEE
92views Hardware» more  DATE 1999»
15 years 4 months ago
Efficient Techniques for Modeling Chip-Level Interconnect, Substrate and Package Parasitics
Modern IC design requires accurate analysis and modeling of chip-level interconnect, the substrate and package parasitics. Traditional approaches for such analyses are computation...
Peter Feldmann, Sharad Kapur, David E. Long
ISQED
2003
IEEE
92views Hardware» more  ISQED 2003»
15 years 4 months ago
Parameterized Macrocells with Accurate Delay Models for Core-Based Designs
In this paper we propose a new design methodology targeted for core-based designs using parameterized macrocells (PMC’s). This methodology provides the flexibility for instance...
Makram M. Mansour, Mohammad M. Mansour, Amit Mehro...
ICCAD
2003
IEEE
144views Hardware» more  ICCAD 2003»
15 years 8 months ago
A High-level Interconnect Power Model for Design Space Exploration
— In this paper, we present a high-level power model to estimate the power consumption in semi-global and global interconnects. Such interconnects are used for communications bet...
Pallav Gupta, Lin Zhong, Niraj K. Jha
VLSID
2003
IEEE
77views VLSI» more  VLSID 2003»
16 years 16 hour ago
A Methodology for Accurate Modeling of Energy Dissipation in Array Structures
There is an increasing need for obtaining a reasonably accurate estimate of energy dissipation in SoC designs. Array structures have a significant contribution to the total system...
Mahesh Mamidipaka, Nikil D. Dutt, Kamal S. Khouri
TC
2008
14 years 11 months ago
Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model
Abstract-- Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; considering thermal effects early in the design c...
Wei Huang, Karthik Sankaranarayanan, Kevin Skadron...