380 search results - page 48 / 76 » Accurate Predictive Interconnect Modeling for System-Level D... |
137
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SIGOPS
2010
14 years 6 months ago
2010
Modern chip-level multiprocessors (CMPs) contain multiple processor cores sharing a common last-level cache, memory interconnects, and other hardware resources. Workloads running ...
106
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3DIC
2009
IEEE
15 years 6 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
105
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MSWIM
2006
ACM
15 years 5 months ago
2006
ACM
As mobile devices, such as laptops, PDAs or mobile phones, are getting more and more ubiquitous and are able to communicate with each other via wireless technologies, the paradigm...
ASPDAC
2006
ACM
15 years 5 months ago
2006
ACM
: With technology scaling, elevated temperatures caused by increased power density create a critical bottleneck modulating the circuit operation. With the advent of FinFET technolo...
130
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KDD
2008
ACM
16 years 6 days ago
2008
ACM
Many time series prediction methods have focused on single step or short term prediction problems due to the inherent difficulty in controlling the propagation of errors from one ...