- With the increasing levels of variability in the behavior of manufactured nano-scale devices and dramatic changes in the power density on a chip, timely identification of hot spo...
The main contribution of this work is an analytical model for finding the upper bound on the temperature difference among various locations on the die. The proposed model can be u...
— It has been the conventional assumption that, due to the superlinear dependence of leakage power consumption on temperature, and widely varying on-chip temperature profiles, a...
Yongpan Liu, Robert P. Dick, Li Shang, Huazhong Ya...
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
Compute clusters are consuming more power at higher densities than ever before. This results in increased thermal dissipation, the need for powerful cooling systems, and ultimatel...
Kirk W. Cameron, Hari K. Pyla, Srinidhi Varadaraja...