11384 search results - page 405 / 2277 » Achieved IPC Performance |
116
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ASPDAC
2012
ACM
14 years 3 days ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
132
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CORR
2012
Springer
14 years 2 days ago
2012
Springer
: Software development is still based on manufactory production, and most of the programming code is still hand-crafted. Software development is very far away from the ultimate goa...
148
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IUI
2012
ACM
13 years 12 months ago
2012
ACM
We demonstrate our airwriting interface for mobile handsfree text entry. The interface enables a user to input text into a computer by writing in the air like on an imaginary blac...
164
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TSP
2012
13 years 12 months ago
2012
Abstract—We consider a robust downlink beamforming optimization problem for secondary multicast transmission in a multiple-input multiple-output (MIMO) spectrum sharing cognitive...
269
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WACV
2012
IEEE
13 years 12 months ago
2012
IEEE
We combine and extend the previous work on DCT-based image signatures and face detection to determine the visual saliency. To this end, we transfer the scalar definition of image...