3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
We introduce techniques to support efficient non-atomic execution of very long traces on a new binary translation based, x86-64 compatible VLIW microprocessor. Incrementally comm...
Modulo scheduling is an effective code generation technique that exploits the parallelism in program loops by overlapping iterations. One drawback of this optimization is that reg...
SQL (Structured Query Language) is one of the essential topics in foundation databases courses in higher education. Due to its apparent simple syntax, learning to use the full pow...
Shazia Wasim Sadiq, Maria E. Orlowska, Wasim Sadiq...
Due to the ever-widening performance gap between processors and disks, I/O operations tend to become the major performance bottleneck of data-intensive applications on modern clus...
Yifeng Zhu, Hong Jiang, Xiao Qin, Dan Feng, David ...