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MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
15 years 3 months ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
MICRO
2005
IEEE
105views Hardware» more  MICRO 2005»
15 years 3 months ago
Incremental Commit Groups for Non-Atomic Trace Processing
We introduce techniques to support efficient non-atomic execution of very long traces on a new binary translation based, x86-64 compatible VLIW microprocessor. Incrementally comm...
Matt T. Yourst, Kanad Ghose
PLDI
2005
ACM
15 years 3 months ago
Demystifying on-the-fly spill code
Modulo scheduling is an effective code generation technique that exploits the parallelism in program loops by overlapping iterations. One drawback of this optimization is that reg...
Alex Aletà, Josep M. Codina, Antonio Gonz&a...
98
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ITICSE
2004
ACM
15 years 3 months ago
SQLator: an online SQL learning workbench
SQL (Structured Query Language) is one of the essential topics in foundation databases courses in higher education. Due to its apparent simple syntax, learning to use the full pow...
Shazia Wasim Sadiq, Maria E. Orlowska, Wasim Sadiq...
CCGRID
2003
IEEE
15 years 2 months ago
Improved Read Performance in a Cost-Effective, Fault-Tolerant Parallel Virtual File System (CEFT-PVFS)
Due to the ever-widening performance gap between processors and disks, I/O operations tend to become the major performance bottleneck of data-intensive applications on modern clus...
Yifeng Zhu, Hong Jiang, Xiao Qin, Dan Feng, David ...