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CODES
2007
IEEE
15 years 6 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
DSN
2007
IEEE
15 years 6 months ago
Utilizing Dynamically Coupled Cores to Form a Resilient Chip Multiprocessor
Aggressive CMOS scaling will make future chip multiprocessors (CMPs) increasingly susceptible to transient faults, hard errors, manufacturing defects, and process variations. Exis...
Christopher LaFrieda, Engin Ipek, José F. M...
TSE
2002
122views more  TSE 2002»
14 years 11 months ago
Virtual Benchmarking and Model Continuity in Prototyping Embedded Multiprocessor Signal Processing Systems
The complexity of hardware/software codesign of embedded real-time signal processing systems can be reduced by rapid system prototyping (RSP). However, existing RSP frameworks do n...
Randall S. Janka, Linda M. Wills, Lewis B. Baumsta...
MAM
2006
125views more  MAM 2006»
14 years 11 months ago
Stream computations organized for reconfigurable execution
Reconfigurable systems can offer the high spatial parallelism and fine-grained, bit-level resource control traditionally associated with hardware implementations, along with the f...
André DeHon, Yury Markovsky, Eylon Caspi, M...
HPCA
2003
IEEE
16 years 7 days ago
Variability in Architectural Simulations of Multi-Threaded Workloads
Multi-threaded commercial workloads implement many important internet services. Consequently, these workloads are increasingly used to evaluate the performance of uniprocessor and...
Alaa R. Alameldeen, David A. Wood