3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Aggressive CMOS scaling will make future chip multiprocessors (CMPs) increasingly susceptible to transient faults, hard errors, manufacturing defects, and process variations. Exis...
The complexity of hardware/software codesign of embedded real-time signal processing systems can be reduced by rapid system prototyping (RSP). However, existing RSP frameworks do n...
Randall S. Janka, Linda M. Wills, Lewis B. Baumsta...
Reconfigurable systems can offer the high spatial parallelism and fine-grained, bit-level resource control traditionally associated with hardware implementations, along with the f...
Multi-threaded commercial workloads implement many important internet services. Consequently, these workloads are increasingly used to evaluate the performance of uniprocessor and...