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DAC
2007
ACM
16 years 2 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
CVPR
2010
IEEE
15 years 9 months ago
A Novel Riemannian Framework for Shape Analysis of 3D Objects
In this paper we introduce a novel Riemannian framework for shape analysis of parameterized surfaces. We derive a distance function between any two surfaces that is invariant to r...
Sebastian Kurtek, Eric Klassen, Anuj Srivastava, Z...
INFOCOM
2008
IEEE
15 years 8 months ago
Fair Scheduling through Packet Election
—In this paper, we consider the problem of designing scheduling algorithm for input queued switch that is both fair as well as throughput optimal. The significant body of litera...
Srikanth Jagabathula, Vishal Doshi, Devavrat Shah
ICC
2007
IEEE
118views Communications» more  ICC 2007»
15 years 8 months ago
A Class of LDPC Erasure Distributions with Closed-Form Threshold Expression
— In this paper, a family of low-density parity-check (LDPC) degree distributions, whose decoding threshold on the binary erasure channel (BEC) admits a simple closed form, is pr...
Enrico Paolini, Marco Chiani
ICC
2007
IEEE
102views Communications» more  ICC 2007»
15 years 8 months ago
M-gated Scheduling in Wireless Networks: Performance and Cross-layer Design
—E-limited (or K-limited) scheduling is attractive because its performance is close to that of the exhaustive scheduling which is proven to be the optimal polling scheme for symm...
Yan Li, Guangxi Zhu