Optical lithography is a critical step in the semiconductor manufacturing process, and one key problem is the design of the photomask for a particular circuit pattern, given the o...
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
Combining information from the higher level and the lower level has long been recognized as an essential component in holistic image understanding. However, an efficient inferenc...
In this paper, we address the problem of photometric invariance in multispectral imaging making use of an optimisation approach based upon the dichromatic model. In this manner, w...
This paper is concerned with the problem of recovering an unknown matrix from a small fraction of its entries. This is known as the matrix completion problem, and comes up in a gr...