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ICCAD
2007
IEEE
143views Hardware» more  ICCAD 2007»
16 years 3 months ago
TIP-OPC: a new topological invariant paradigm for pixel based optical proximity correction
—As the 193nm lithography is likely to be used for 45nm and even 32nm processes, much more stringent requirement will be posed on Optical Proximity Correction (OPC) technologies....
Peng Yu, David Z. Pan
ICCAD
2004
IEEE
87views Hardware» more  ICCAD 2004»
16 years 3 months ago
Exploiting level sensitive latches in wire pipelining
Wire pipelining emerges as a new necessity for global wires due to increasing wire delay, shrinking clock period and growing chip size. Existing approaches on wire pipelining are ...
V. Seth, Min Zhao, Jiang Hu
ICCAD
2003
IEEE
143views Hardware» more  ICCAD 2003»
16 years 3 months ago
Fractional Cut: Improved Recursive Bisection Placement
In this paper, we present improvements to recursive bisection based placement. In contrast to prior work, our horizontal cut lines are not restricted to row boundaries; this avoid...
Ameya R. Agnihotri, Mehmet Can Yildiz, Ateen Khatk...
ICCAD
2003
IEEE
122views Hardware» more  ICCAD 2003»
16 years 3 months ago
Weibull Based Analytical Waveform Model
Current CMOS technologies are characterized by interconnect lines with increased relative resistance w.r.t. driver output resistance. Designs generate signal waveshapes that are v...
Chirayu S. Amin, Florentin Dartu, Yehea I. Ismail
ICCAD
2003
IEEE
142views Hardware» more  ICCAD 2003»
16 years 3 months ago
SuPREME: Substrate and Power-delivery Reluctance-Enhanced Macromodel Evaluation
The recent demand for system-on-chip RF mixed-signal design and aggressive supply-voltage reduction require chip-level accurate analysis of both the substrate and power delivery s...
Tsung-Hao Chen, Clement Luk, Charlie Chung-Ping Ch...
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