Sciweavers

13841 search results - page 2222 / 2769
» Algorithms and Constraint Programming
Sort
View
DAC
2007
ACM
16 years 8 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
216
Voted
DAC
2007
ACM
16 years 8 months ago
Multiprocessor Resource Allocation for Throughput-Constrained Synchronous Dataflow Graphs
Abstract. Embedded multimedia systems often run multiple time-constrained applications simultaneously. These systems use multiprocessor systems-on-chip of which it must be guarante...
Sander Stuijk, Twan Basten, Marc Geilen, Henk Corp...
DAC
1999
ACM
16 years 8 months ago
Power Efficient Mediaprocessors: Design Space Exploration
We present a framework for rapidly exploring the design space of low power application-specific programmable processors (ASPP), in particular mediaprocessors. We focus on a catego...
Johnson Kin, Chunho Lee, William H. Mangione-Smith...
DAC
2004
ACM
16 years 8 months ago
Adaptive data partitioning for ambient multimedia
In the near future, Ambient Intelligence (AmI) will become part of everyday life. Combining feature-rich multimedia with AmI (dubbed Ambient Multimedia for short) has the potentia...
Xiaoping Hu, Radu Marculescu
DAC
2004
ACM
16 years 8 months ago
Leakage aware dynamic voltage scaling for real-time embedded systems
A five-fold increase in leakage current is predicted with each technology generation. While Dynamic Voltage Scaling (DVS) is known to reduce dynamic power consumption, it also cau...
Ravindra Jejurikar, Cristiano Pereira, Rajesh K. G...
« Prev « First page 2222 / 2769 Last » Next »