Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Abstract. Embedded multimedia systems often run multiple time-constrained applications simultaneously. These systems use multiprocessor systems-on-chip of which it must be guarante...
Sander Stuijk, Twan Basten, Marc Geilen, Henk Corp...
We present a framework for rapidly exploring the design space of low power application-specific programmable processors (ASPP), in particular mediaprocessors. We focus on a catego...
Johnson Kin, Chunho Lee, William H. Mangione-Smith...
In the near future, Ambient Intelligence (AmI) will become part of everyday life. Combining feature-rich multimedia with AmI (dubbed Ambient Multimedia for short) has the potentia...
A five-fold increase in leakage current is predicted with each technology generation. While Dynamic Voltage Scaling (DVS) is known to reduce dynamic power consumption, it also cau...
Ravindra Jejurikar, Cristiano Pereira, Rajesh K. G...