Many years of CMOS technology scaling have resulted in increased power densities and higher core temperatures. Power and temperature concerns are now considered to be a primary cha...
Daniel C. Vanderster, Amirali Baniasadi, Nikitas J...
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
—Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocessor system-on-chip (MPSoC) use in hard real-time systems. This article formalizes the t...
Thidapat Chantem, Robert P. Dick, Xiaobo Sharon Hu
Abstract—On-chip power density and temperature are rising exponentially with decreasing feature sizes. This alarming trend calls for temperature management at every level of syst...