This paper explores the power implications of replacing global chip wires with an on-chip network. We optimize network links by varying repeater spacing, link pipelining, and volt...
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
As the level of chip integration continues to advance at a fast pace, the desire for efficient interconnects-whether on-chip or off-chip--is rapidly increasing. Traditional interc...
An effective query optimizer finds a query plan that exploits the characteristics of the source data. In data integration, little is known in advance about sources' propertie...
— The forthcoming 4G cellular systems will provide broadband wireless access to a variety of advanced data and voice services. In order to do that, these networks will have a sig...