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96
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CODES
2007
IEEE
15 years 3 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
MOBISYS
2007
ACM
15 years 9 months ago
2007
ACM
The ease of deployment of battery-powered and mobile systems is pushing the network edge far from powered infrastructures. A primary challenge in building untethered systems is of...
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CW
2003
IEEE
15 years 2 months ago
2003
IEEE
This study concerns virtual environments for training in operational conditions. The principal developed idea is that these environments are heterogeneous and open multi-agent sys...
SEUS
2005
IEEE
15 years 3 months ago
2005
IEEE
This paper introduces a novel resource management approach based on personal service aggregations(PSAs) for smart spaces. As a smart space is usually a sharable system that simult...
CASES
2004
ACM
15 years 3 months ago
2004
ACM
While the dynamic voltage scaling (DVS) techniques are efficient in reducing the dynamic energy consumption for the processor, varying voltage alone becomes less effective for t...