Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
We introduce a novel algorithm to address the challenges in magnetic resonance (MR) spectroscopic imaging. In contrast to classical sequential data processing schemes, the proposed...
—Recent advances in cognitive radio (CR) technology have brought about a number of wireless standards that support opportunistic access to available white-space spectrum. Address...
We consider buffer management of unit packets with deadlines for a multi-port device with reconfiguration overhead. The goal is to maximize the throughput of the device, i.e., the...
Yossi Azar, Uriel Feige, Iftah Gamzu, Thomas Mosci...
Contention for shared resources on multicore processors remains an unsolved problem in existing systems despite significant research efforts dedicated to this problem in the past...
Sergey Zhuravlev, Sergey Blagodurov, Alexandra Fed...