Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
—Connecting system-level performance models with circuit information has been a long-standing problem in analog/mixed-signal front-ends, like radios and high-speed links. High-sp...
Artificial neural networks (ANN) have been widely used for both classification and prediction. This paper is focused on the prediction problem in which an unknown function is appr...
The solution of elliptic diffusion operators is the computational bottleneck in many simulations in a wide range of engineering and scientific disciplines. We present a truly sca...
Mark F. Adams, Harun H. Bayraktar, Tony M. Keaveny...
Bounding constraints are used to bound the tolerance of solutions under certain undesirable features. Standard solvers propagate them one by one. Often times, it is easy to satisfy...