22864 search results - page 4518 / 4573 » An Integrated and |
ICCAD
2009
IEEE
14 years 11 months ago
2009
IEEE
The flip-chip package is introduced for modern IC designs with higher integration density and larger I/O counts. In this paper, we consider the pre-assignment flip-chip routing pr...
124
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ICCAD
2009
IEEE
14 years 11 months ago
2009
IEEE
In a behavioral synthesis system, a typical approach used to guide the scheduler is to impose hard constraints on the relative timing between operations considering performance, a...
120
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ICCAD
2009
IEEE
14 years 11 months ago
2009
IEEE
Modern circuits become harder to route with the ever decreasing design features. Previous routability-driven placement techniques are usually tightly coupled with the underlying p...
125
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ICCAD
2009
IEEE
14 years 11 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
123
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ICCAD
2009
IEEE
14 years 11 months ago
2009
IEEE
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...