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» An Interconnect Energy Model Considering Coupling Effects
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ICCAD
1994
IEEE
121views Hardware» more  ICCAD 1994»
15 years 1 months ago
A cell-based power estimation in CMOS combinational circuits
In this paper we present a power dissipation model considering the charging/discharging of capacitance at the gate output node as well as internal nodes, and capacitance feedthrou...
Jiing-Yuan Lin, Tai-Chien Liu, Wen-Zen Shen
ICASSP
2011
IEEE
14 years 1 months ago
Using multiple visual tandem streams in audio-visual speech recognition
The method which is called the “tandem approach” in speech recognition has been shown to increase performance by using classifier posterior probabilities as observations in a...
Ibrahim Saygin Topkaya, Hakan Erdogan
ICCAD
2006
IEEE
136views Hardware» more  ICCAD 2006»
15 years 6 months ago
An electrothermally-aware full-chip substrate temperature gradient evaluation methodology for leakage dominant technologies with
As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are b...
Sheng-Chih Lin, Kaustav Banerjee
ICASSP
2011
IEEE
14 years 1 months ago
Dense disparity estimation from linear measurements
This paper proposes a methodology to estimate the correlation model between a pair of images that are given under the form of linear measurements. We consider an image pair whose ...
Vijayaraghavan Thirumalai, Pascal Frossard
69
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ISCAS
2007
IEEE
179views Hardware» more  ISCAS 2007»
15 years 4 months ago
Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method
— We present a method for fast analysis of signal and power integrity based on a recently developed multilayered finite difference method (M-FDM). In order to accurately model m...
Ege Engin, Krishna Bharath, Madhavan Swaminathan